Quectel Advances LPWA Connectivity With New Wi-SUN Module For Smarter Urban Infrastructure

Abhijeet Singh
11 Jun 2025
11:01 AM
1 Min Read

The KCM0A5S module’s mesh networking ability finds growing relevance in connected mobility and smart city systems.


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Quectel Wireless Solutions has introduced its latest KCM0A5S Wi-SUN module developed to support the evolving demands of smart infrastructure and utility systems. The launch highlights Quectel’s intention to deepen its presence in the low power wide area (LPWA) segment with a product that delivers reliable long-range communication, robust mesh networking and durable field performance. Built on Silicon Labs’ EFR32FG25 chip and powered by an ARM Cortex-M33 processor, the KCM0A5S is aimed at a variety of applications ranging from smart meters and precision agriculture to industrial IoT and urban mobility services.

The KCM0A5S complies with Wi-SUN FAN 1.1 protocol and operates within the 470–928 MHz band. With mesh networking built on IPv6 and the ability to operate as a standalone node or co-processor in more complex systems, the module is engineered for deployment flexibility. This allows it to function effectively across diverse and challenging operating environments, including those often encountered in underground or enclosed urban setups. This is particularly relevant for transport authorities and city planners aiming to deploy integrated control systems for public lighting, traffic, parking and utility management.

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Automotive and smart mobility ecosystems may also benefit from the module’s mesh capabilities, especially as vehicle-to-infrastructure (V2I) solutions begin to integrate IoT nodes for improved traffic flow and operational coordination. With public transport systems increasingly dependent on connected networks for real-time updates, service reliability, and energy optimisation, modules like Quectel’s can play a pivotal role in enabling data-driven governance. As cities invest in electric vehicle infrastructure and dynamic traffic systems, the ability of Wi-SUN networks to scale across thousands of endpoints without central failure is a significant technical advantage.

With a lifespan of at least a decade and compatibility across Wi-SUN FAN network versions, the KCM0A5S also addresses industry concerns around lifecycle mismatches and replacement costs. Furthermore, its compact form factor and thermal tolerance ranging from -40 °C to +85 °C make it suitable for field applications across climates and geographies. The inclusion of both OFDM and FSK modulation options, subject to local regulatory permissions, increases its range of deployment in regions such as North America, Latin America and parts of Asia Pacific.

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