Texas Instruments (TI) has announced a strategic collaboration with NVIDIA to develop advanced power management and sensing technologies that will support NVIDIA’s future 800V high-voltage direct current (HVDC) power distribution systems for AI data center servers.
As AI capabilities expand, the energy required per server rack is set to surge from today’s 100kW to over 1 megawatt in the near future. Traditional 48V systems, which would require nearly 450 pounds of copper to support such loads, are no longer feasible at scale. The introduction of an 800V HVDC system promises to dramatically increase power density and conversion efficiency, while reducing the size, weight, and complexity of data center power infrastructure.
“A paradigm shift is happening right in front of our eyes,” said Jeffrey Morroni, director of power management R&D at TI’s Kilby Labs and a TI Fellow. “AI data centers are pushing the limits of power to previously unimaginable levels. TI’s expertise in power conversion, coupled with NVIDIA’s AI leadership, is enabling this next-generation 800V architecture to meet those demands.”
Gabriele Gorla, VP of System Engineering at NVIDIA, added, “Semiconductor power systems are a crucial enabler for high-performance AI infrastructure. Our work with TI to develop an 800V DC architecture will help ensure efficient, scalable power delivery for the data centers of tomorrow.”
The 800V power distribution model is set to redefine the foundation of AI infrastructure, enabling engineers to design more power-efficient, compact, and scalable systems that can keep pace with the accelerating growth of AI computing.
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