Hyundai Mobis will unveil its Hyundai Mobis' MTCU (multi-functional telematics control unit) connectivity modules at the upcoming IAA Mobility exhibition in Munich.
The module, expected to be available in 2024, will enable car manufacturers to offer advanced safety applications based on V2X communication.
As the demand for V2X continues to grow, primarily driven by the global NCAP roadmap, Hyundai Mobis selected Autotalks' 3rd generation chipset to power its next-generation connectivity module solution, MTCU Gen2.
MTCU Gen2 enables a range of use-cases from basic Day-1 to advanced Day-2 V2X applications. This is achieved through its inherent support for the latest global V2X standards, dual-channel operation, and the integration of functional safety-grade implementation, enabling car actuation based on V2X data.
Besides the MTCU Gen 2 connectivity module, Hyundai Mobis will also showcase its technical advancements and provide visitors with a glimpse into the future of connected-car user experiences.
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