Tessolve has announced a strategic collaboration with NXP Semiconductors. This partnership aims to accelerate the deployment of a state-of-the-art Digital Connected Cluster (DCC) solution, specifically tailored for mass-market vehicles.
This innovative collaboration leverages the strengths of Tessolve's engineering expertise and NXP's semiconductor technology to offer a Digital Connected Cluster platform that integrates seamlessly into two-wheelers and three-wheelers. The core of this advanced system is NXP’s i.MX RT1170 crossover MCU, combined with the AW611 Wi-Fi/Bluetooth combo chip, KW45 Bluetooth LE smart access MCU, and PF5103 multi-channel PMIC, creating a robust, feature-rich solution for Original Equipment Manufacturers (OEMs).
The Digital Connected Cluster, powered by NXP's i.MX RT1170-based SMARC SoM, features a 5-inch display, which can be upgraded to 7-inch, and is equipped with state-of-the-art chipsets enabling BLE and Wi-Fi 6 connectivity, along with a multi-channel power management system and CAN interface, making it a comprehensive, production-ready package.
Dan Loop, Vice President and General Manager, Automotive Edge Product Lines at NXP, emphasised the critical role of high-resolution digital displays in the safe operation of electric vehicles. He highlighted how the new DCC solution offers advanced graphics, smartphone connectivity, and vital vehicle information, all within a cost-effective system, thereby enhancing the driving experience and safety for EV operators.
Echoing the sentiment, Kiran Kumar Nagendra, AVP- Embedded Systems at Tessolve, elaborated on the flexibility of the new digital cluster, which is built on Tessolve's 3-D product engineering principle. This framework ensures that the solution can be adopted 'as is' or customised to meet specific OEM needs, significantly accelerating the time-to-market for new vehicle models.
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